multilayer ceramic chip capacitors 1 of 3 creation date : november 30, 2017 (gmt) C2012X7R1H224K125AE tdk item description c2012x7r1h224kt***s applications commercial grade please refer to part no. cga4j2x7r1h224k125ae for automotive use. feature soft soft termination series c2012 [eia 0805] status production size length(l) 2.00mm +0.45,-0.20mm width(w) 1.25mm +0.25,-0.20mm thickness(t) 1.25mm +0.25,-0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 220nf 10% rated voltage 50vdc temperature characteristic x7r(15%) dissipation factor (max.) 3% insulation resistance (min.) 2272m other soldering method wave (flow) re?ow aec-q200 no packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 30, 2017 (gmt) C2012X7R1H224K125AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance C2012X7R1H224K125AE esr C2012X7R1H224K125AE capacitance C2012X7R1H224K125AE dc bias characteristic C2012X7R1H224K125AE temperature characteristic C2012X7R1H224K125AE(no bias) C2012X7R1H224K125AE(dc bias = 25v) ripple temperature rising C2012X7R1H224K125AE(100khz) C2012X7R1H224K125AE(500khz) C2012X7R1H224K125AE(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 30, 2017 (gmt) C2012X7R1H224K125AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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